KWS Microtec AG successfully launched Thinlam technology

KWS Microtec AG known as the world's leading supplier of RFID (Radio Frequency Identification) components for special and standard applications such as public transport, ePayment, asset management, access control and high security applications recently launched Thinlam 's new technology - revolutionary contactless prelaminate for RFID applications. Thinlam being the ideal solution for any contactless personal identification well performed and designed earned trust to deal with KSW Microtec AG. It received good feedback from partners, customers and visitors and now is focusing on production of HF and UHF RFID cards with more layers for security. The new salvation from KSW and Thinlam with a thickness down to 280 m is manufactured without chip modules and can be used for any contactless personal identification application, even for transparent RFID cards.

It is expected that new technology will strengthen company's position as dynamic innovator and setter of standards in the RFID industry. 

HF and UHF RFID cards with more layers will improve the possibilities to integrate more security and other high value features into cards. The mentioned thinnesse of the product is the result of manufacture of the Thinlam without chip modules. It means that smoother card surfaces and better printing outcome are guaranteed. It helps Thinlam get the highest durability. In addition, due to the consistently reproducible antenna geometries, KWS Thinlam achieves tighter resonance frequency tolerances. Its excellent optical characteristics allow Thinlam can be made on PVC, Polycardbonate, PET or Teslin.